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Shenzhen Tepu Ke Electronic Equipment Co.,Ltd.

Contact: 135 1032 1270 (Miss Jiang)

Mail box: market@topsmt.com

Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen

MPM-Edison solder paste printing machine

2023-09-22
7700
MPM-Edison solder paste printing machine

Detailed introduction

characteristic:

MPM-Edison solder paste printing machine has unparalleled speed and accuracy capabilities. High productivity, optimized process. Edison gives you more productivity than ever before: 15 seconds total cycle time, including print and stencil wipe cycle times. This is due to Edison's design, which greatly reduces the single printing cycle time, thus saving cumulative time.

 

MPM-Edison solder paste printing machine parameters:

Larger substrate size (XxY): 450mmx350mm (17.72”x13.78”)

For boards larger than 14", special clamps are required

Minimum substrate size (XxY): 50mmx50mm (1.97”x1.97”)

Substrate thickness size:

FoilClamps (foil clamping system): 0.2mm to 6.0mm (0.007” to 0.236”)

EdgeLoc (Edge Clamping System): 0.8mm to 6.0mm (0.031” to 0.236”)

Maximum substrate weight: 4.5kg (10lbs)

Substrate edge clearance: 3.0mm (0.118")

Bottom clearance: 12.7mm (0.5") standard. Configurable 25.4mm (1.0")

Substrate Clamping: Fixed Top Clamping, Table Vacuum Optional: EdgeLoc Edge Clamping System

Substrate support method: magnetic ejector pins and support blocks


Printing parameters:

Larger printing area (XxY): 450mmx350mm (17.71"x13.78")

Printing release (Snap-off): 0mm to 6.35mm (0" to 0.25")

Printing speed: 305mm/second (12.0"/second)

Printing pressure: 0 to 20kg (0lb to 44lbs)

Template frame size: 737mmx737mm (29"x29") Smaller size templates are available

Image field of view (FOV): 9.0mmx6.0mm (0.354”x0.236”)

Reference point type: standard shape reference point (see SMEMA standard), pad/opening

Camera System: Single Digital Camera - Zhuanli's Split Optical Vision

Alignment accuracy and repeatability of the entire system: ±8 microns (±0.0003”)@6σ, Cpk≥2.0*

Technical indicators are expressed through process changes in the production environment. This performance data includes printing speed, table lift and camera movement.

Actual solder paste placement accuracy and repeatability: ±15 microns (±0.0006”)@6σ, Cpk≥2.0*

Actual solder paste printing position repeatability based on third-party test system verification

Cycle time: 30015 seconds including printing and wiping, 20020 seconds including printing and wiping

Power requirements: 200 to 240VAC (±10%) single phase @50/60Hz, 15A

Compressed air requirements: 100psi@4cfm (standard operation mode) to 18cfm (vacuum wipe) (6.89bar@1.9L/s to 8.5L/s), 12.7mm (0.5”) diameter pipe

Machine height: (minus light tower) 1580mm (62.2") at 940mm (37.0") transport height

Machine depth: 1442mm (56.77")

Machine width: 1282mm (50.47”)

Minimum front clearance: 508mm (20.0”)

Minimum clearance behind: 508mm (20.0”)

BTB (back to back) configuration: 10mm (0.39”)

MPM-Edison solder paste printing machine.png


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Contact

National service hotline

135 1032 1270

Contact: Miss Jiang

Mail box: market@topsmt.com

Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen