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Shenzhen Tepu Ke Electronic Equipment Co.,Ltd.

Contact: 135 1032 1270 (Miss Jiang)

Mail box: market@topsmt.com

Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen

OMRON VT-X700/X-RAY

2023-09-23
7202
OMRON VT-X700/X-RAY

Detailed introduction

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Product brand: OMRON Omron

Product model: OMRON VT-X700/X-RAY

Origin: Japan

 OMRON VT-X700/X-RAY : In recent years, in the automotive electronics industry, consumer electronics industry, and digital home appliance industry, in addition to the requirements for size, multi-function, high performance, etc., more and more manufacturers have Increased high-density component placement.

The mounting substrates assembled into finished products also use a large number of components such as BGA/CSP whose solder joint surfaces cannot be seen on the surface. In the past, X-ray fluoroscopy inspection methods caused many misjudgments and missed diagnoses, making the inspection results extremely unstable.



Omron VT-X700/X-RAY solves the practical problems of your SMT production line:

1: High reliability

Omron VT-X700/X-RAY uses CT tomography to detect shapes that cannot be detected by penetrating X-ray devices or visual inspection, such as the solder joint surface of BGA components. Quality judgment can be achieved.

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2: high speed

The inspection time of one FOV only takes 4 seconds, achieving high-speed inspection.

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3: Omron VT-X700/X-RAY is safe and secure

Safe, the leakage of X-rays is less than 0.5μSv/h. X-rays are emitted in pulse mode only when needed, which not only reduces the amount of radiation emitted, but also extends the service life of internal components.


Omron VT-X700/X-RAY performance features:

 

High-speed X-ray CT tomography automatic inspection device
model: VT-X700-E, VT-X700-L

 
Omron VT-X700/X-RAY, a high-speed CT tomography X-ray inspection device that supports mass production online full inspection


Omron VT-X700/X-RAY working mode:


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Omron VT-X700/X-RAY analysis mode:

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Omron VT-X700/X-RAY technical parameters:


project

content

Model

VT-X700-E VT-X700-L

Check object component

BGA/CSP, plug-in components, SOP/QFP, transistors, CHIP components, bottom electrode components, QFN, power modules

Check item

Missing solder, non-wetting, amount of solder, offset, foreign matter, bridge, presence of pins, etc. (different selections are made according to the inspection objects)

Camera specifications

Camera method

3D slice imaging with parallel CT

Camera resolution

10.15, 20, 25, 30 m (can be selected according to different inspection objects)

X-ray source

Sealed micro focusing X-ray tube (130KV)

X-ray sensor

FPD

Target substrate

Substrate size

Corresponding substrate (50×50-330×305mm) thickness: 0.4-3.0mm

Corresponding substrate (50×50-610×610mm) thickness: 0.6-7.0mm

Board weight

2.0kg or less (components mounted)

12.0kg or less (components mounted)

Mounted component height

Surface: below 50mm

Reverse: 20mm or less

Plate bending

2.0mm or less

Below 3.0mm

Machine specifications

Dimensions

1.550 (W) X1.650 (D) X1.620 (H) mm

2.180(W) X2.500(D)×1.720(H)mm

Device weight

About 2.920kg

About 5,250kg

Substrate transfer height

900±15mm

voltage

Single phase 200/210/220/230/240VAC(±10%),50/60Hz

3

power

3.1kVA

4.7kVA

x-ray leakage

Less than 0.5 uSv/h


Contact

National service hotline

135 1032 1270

Contact: Miss Jiang

Mail box: market@topsmt.com

Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen