VI 3D solder paste inspection equipment PI Series features

1. Automatic programming can be used for testing new products    

2. In addition to solder paste detection, PIE can also perform fixing glue detection.    

3. Automatic pad separation can be realized through area area ratio     

4. 3D large image inspection makes it easier to diagnose problems      

5. Real-time program monitoring through SIGMA analysis technology, offline SPC, and embedded SPC      

6. The Z-axis can measure small pads without being affected by board bending deformation; and its stability and stability can be ensured through substrate correction.   

7. Multi-frequency, Moore can achieve precise testing results in the actual production process       

8. High-precision 3D imaging provides clear defective classification

  VI 3D solder paste inspection equipment PI Series details