Product Features:

Siemens placement machine X2S top SMT production line, wherever the nominal value of the SIPLACE X series can achieve the required maximum speed and accuracy. Siemens siplace x2s is suitable for automotive electronics, mobile phones, tablets, laptops, LED mounting, etc. Provide customers with the highest speed, lowest dpm, stable 0201 (metric) processing capabilities, non-stop setting conversion and rapid new product introduction and other functions. ASM_SIPLACE placement machine - The performance of the Siemens placement machine SIPLACE X2S X series cannot be matched by other equipment manufacturers.

SIPLACE X2 S technical parameters: 

Number of cantilevers: 2

IPC speed: 52,000cph

SIPLACE Benchmark: 64,000cph

Theoretical speed: 85,250cph

Machine size: 1.9x2.3m

Placement head features: TwinStar

Component range: 0201"-200x125mm

Mounting accuracy: ±22μm/3σ

Angular accuracy: ±0,05°/3σ

Maximum component height: 25mm

Mounting force: 1,0-15 Newtons

Conveyor belt type: single track, flexible double track

Conveyor mode: asynchronous, synchronous, independent placement mode (X4iS)

PCB format: 50x50mm-850x560mm

PCB thickness: 0,3-4,5mm (other sizes can be customized upon request)

PCB weight: maximum 3kg

Component supply and material supply                                    

Feeder capacity: 160 8mmX feeder modules

Feeder module type:        

  SIPLACE component cart, SIPLACE matrix tray feeder (MTC), waffle tray (WPC5/WPC6),

  JTF-S/JTF-MSIPLACE, X feeder, Tray plate, vibrating tube, vibrating feeder, customized OEM feeder module

Pickup rate: ≥99,95%

DPM rate: ≤3dpm

Lighting level: Level 6 illumination 

Remark:

Machine size, only for the main body of the equipment

PCB format: Extended input and output rails allow board lengths up to 850mm