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Shenzhen Tepu Ke Electronic Equipment Co.,Ltd.

Contact: 135 1032 1270 (Miss Jiang)

Mail box:

Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen

K&S HYbrid3 Semiconductor Wafer Mounter

K&S HYbrid3 Semiconductor Wafer Mounter

Detailed introduction

K&S HYbrid3 high-speed placement machine

Kulicke & Soffa (Nasdaq: KLIC) provides leading semiconductor packaging and electronic assembly solutions to the global automotive, consumer electronics, communications, computer and industrial markets.

As a pioneer in the semiconductor industry, K&S has been committed to providing customers with market-leading packaging solutions for decades. In recent years, K&S has added advanced packaging, electronic assembly, wedge welding machines and other products through strategic acquisitions and independent research and development. At the same time, it has further expanded the product range of consumables in conjunction with its core products.

Combining its rich industry expertise, strong process technology and R&D capabilities, Kulisofa will wholeheartedly help customers meet the challenges of next-generation electronic component packaging.

Quality starting from the board means immediate productivity improvements.
The iX system continues to enhance the overall process of pick and place and introduces a new lightweight feeder to achieve a pick rate of more than 99.99%, passive components (35 micron) With higher placement, camera-aligned component throughput can be increased by 25%.

Through software optimization of factory process procedures, iX 302 and iX 502 can be easily added to customers' factories. The modular design concept simplifies operation while enhancing overall control in mass production environments.

The unique performance of the industry's placement control process
iX can strictly control each placement, reaching the industry's highest yield rate, thereby lowering costs. High-quality products enable our users to meet the needs of end customers.

The unique placement process is reflected in:
· Advanced PCB collision detection
· No impact force = no component cracking
· Pressure control for closed loop placement
· Placement process inspection (according to blue-print value), every placement can be performed Inspection
· PCB surface mapping allows other placement heads to be mounted without affecting the placement height



National service hotline

135 1032 1270

Contact: Miss Jiang

Mail box:

Address: 201, Building 4, Innovation Port, Hanyu Bay, Fuhai Street, Baoan District, Shenzhen