characteristic:

Panasonic SMT machine CM101 can transfer POP top kit and C4 mounting solder, flux, etc. to the protruding parts with high precision, and has excellent versatility. Excellent interchangeability with CM series products. The modular design concept ensures interchangeability with CM series products. Expand production continuity and evolution. For expanding production scale, only a small amount of initial investment is needed to expand production in stages. In addition, due to the development of the new technological level accumulated in the CM series products, only a small amount of investment is required to realize the equipment upgrade and evolution after delivery.

Technical Parameters:

Substrate size (mm) L50×W50 L460×W360

High-speed placement head with 12 nozzles

Placement speed 0.144 s/chip (A-2 type)

Mounting accuracy ±40 μm/chip (Cpk≧1)

Component size (mm) 0402 chip *1 L12×W12×T6.5

Universal placement head LS8 nozzles

Placement speed 0.19 s/chip (A-0 type)

Mounting accuracy ±50μm/chip, ±35μm/QFP  

Component size (mm) 0402 chip *1 L100×W50×T15*5

Multifunctional placement head with 3 nozzles

Placement speed 0.8 s/QFP (B-0 type)

Mounting accuracy ±35μm/QFP (Cpk≧1)

Component size (mm) 0603 chip L100×W90×T25*6  

Substrate replacement time is about 4.0 s (when there are no mounted components on the back)

Power supply three-phase AC 200, 220, 380, 400, 420, 480 V 1.4 kVA

Air pressure source*2 0.5MPa, 150L/min (ANR)

Equipment size *2 (mm) W1530×D1807×H1430 *3

Weight*4 1720 kg