Product Features:

Siemens HS50 placement machine is equipped with 4 XY main cantilevers. Each rack has a star-shaped 12-nozzle pick-and-place head. The placement head takes turns picking up parts from a fixed feeder and placing these parts on a fixed PCB board. Its characteristics are as follows:

1. Part tapes of all sizes can be filled by joining a new tape behind the soon-to-be-used tape. This eliminates downtime due to part filling.

2. The fixed, shock-proof feeder ensures reliable picking up of even the smallest parts (such as 0201 and 0402 chips).

3. Due to the flexibility of the 12-nozzle pick-and-place head (its ideal nozzle setting and automatic designation), the moving distance is reduced to a minimum, thereby optimizing the placement sequence. 

Technical Parameters: 

Component range: 0.6X0.3mm2 (0201) to 18.7x18.7mm2

Higher placement accuracy: 90um (4sigma)

HS50 placement machine circuit board size: (L * W)

Monorail 50X50mm2 to 368X216mm2 (2"X2" to 14.5"X18")

Double rail 50X50mm2 to 368X216mm2 (2"X2" to 14.5"X8.5")

Feeder capacity: 144 rails, 8mm belt

Feeding table: 4 sets

HS50 power: 4KW

Compressed air: 6.5-10bar, 950NI/min, pipe diameter 3/4"

Shenzhen Topco Electronic Equipment Co., Ltd. specializes in providing the following SMT equipment to electronic manufacturers:

MPM printing press , DEK printing press, Koh Young  SPI , AOI

Panasonic placement machine , Fuji placement machine , Siemens placement machine , placement machine rental

Meilu AOI , Vitronics Soltec reflow soldering , BTU reflow soldering, HELLER reflow soldering

The entire SMT production line equipment, as well as spare parts, services and solutions.